XS-HT210 is a high-temperature resin that holds its shape where other polymers give up: 245°C heat deflection at 0.45 MPa (210°C at 1.8 MPa), 44 MPa tensile strength, and a stiff 3300 MPa bending modulus. It’s the material for connector bodies and test sockets near soldering operations, micro-molds and inserts, steam-sterilizable fixtures, and components in hot, demanding environments.
The formulation trades ductility for rigidity — parts are stiff and dimensionally stable rather than tough, so design for support rather than flex. A low dielectric constant of 2.9 at 5 GHz makes it particularly interesting for high-frequency connector and RF applications where thermal and electrical demands arrive together, and its 500 cps viscosity keeps fine features printable.
The translucent formulation diffuses transmitted light evenly, suited to backlit components, light guides, and applications where internal features must remain partially visible.
XS-HT210 brings genuine high-temperature capability to micro-DLP: stiff, stable, and electrically clean at temperatures that soften everything else on the shelf.
| Property | Value |
|---|---|
| Tensile strength (MPa) | 44 |
| Elongation at break (%) | 2.5 |
| Bending strength (MPa) | 80 |
| Bending modulus (MPa) | 3300 |
| Heat distortion temp. @0.45 MPa (°C) | 245 |
| Heat distortion temp. @1.8 MPa (°C) | 210 |
| Dielectric constant @5 GHz | 2.9 |
| Dielectric loss tanδ @5 GHz | 3.42e-2 |
| Viscosity (cps) | 500 |
| Hardness (Shore) | 80D |
| Color | Translucent |
