XS-HT210 is a high-temperature resin that holds its shape where other polymers give up: 245°C heat deflection at 0.45 MPa (210°C at 1.8 MPa), 44 MPa tensile strength, and a stiff 3300 MPa bending modulus. It’s the material for connector bodies and test sockets near soldering operations, micro-molds and inserts, steam-sterilizable fixtures, and components in hot, demanding environments.
The formulation trades ductility for rigidity — parts are stiff and dimensionally stable rather than tough, so design for support rather than flex. A low dielectric constant of 2.9 at 5 GHz makes it particularly interesting for high-frequency connector and RF applications where thermal and electrical demands arrive together, and its 500 cps viscosity keeps fine features printable.
The black formulation delivers a clean, production-ready finish with high visual contrast for feature inspection, and its opacity sharpens fine-detail resolution by suppressing light scatter during exposure.
XS-HT210 brings genuine high-temperature capability to micro-DLP: stiff, stable, and electrically clean at temperatures that soften everything else on the shelf.
| Property | Value |
|---|---|
| Tensile strength (MPa) | 44 |
| Elongation at break (%) | 2.5 |
| Bending strength (MPa) | 80 |
| Bending modulus (MPa) | 3300 |
| Heat distortion temp. @0.45 MPa (°C) | 245 |
| Heat distortion temp. @1.8 MPa (°C) | 210 |
| Dielectric constant @5 GHz | 2.9 |
| Dielectric loss tanδ @5 GHz | 3.42e-2 |
| Viscosity (cps) | 500 |
| Hardness (Shore) | 80D |
| Color | Black |
